"Thermal Aware Design for Through-Silicon Via (TSV) based 3D ..."

Ujjwal Pasupulety, Bheemappa Halavar, Basavaraj Talawar (2018)

Details and statistics

DOI: 10.1109/ISED.2018.8704109

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06