"Flexible Integrated Circuits via Stress-minimized Layout and Ultra-thin Chip."

Muyao Wang et al. (2024)

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DOI: 10.1109/ISCAS58744.2024.10558471

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-16

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Muyao Wang, Bo Wang, Lu Jia, Haicheng Li, Xue Feng:
Flexible Integrated Circuits via Stress-minimized Layout and Ultra-thin Chip. ISCAS 2024: 1-4

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