"Compact lumped element model for TSV in 3D-ICs."

Khaled Salah et al. (2011)

> Home

Details and statistics

DOI: 10.1109/ISCAS.2011.5938067

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/iscas/SalahRRAI11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iscas/SalahRRAI11
Khaled Salah, Alaa B. El-Rouby, Hani F. Ragai, Karim Amin, Yehea I. Ismail:
Compact lumped element model for TSV in 3D-ICs. ISCAS 2011: 2321-2324

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.