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"Fault tolerant techniques for TSV-based interconnects in 3-D ICs."

Siroos Madani, Magdy A. Bayoumi (2017)

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DOI: 10.1109/ISCAS.2017.8050944

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-20

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  dblp key:
  - conf/iscas/MadaniB17
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  - https://dblp.org/rec/conf/iscas/MadaniB17
Siroos Madani, Magdy A. Bayoumi:
Fault tolerant techniques for TSV-based interconnects in 3-D ICs. ISCAS 2017: 1-4

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