"A novel methodology for power delivery network optimization in 3-D ICs ..."

Bongki Lee et al. (2012)

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DOI: 10.1109/ISCAS.2012.6272021

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Bongki Lee, Byung-Gyu Ahn, Jaehwan Kim, Minbeom Kim, Jong-Wha Chong:
A novel methodology for power delivery network optimization in 3-D ICs using through-silicon-via technology. ISCAS 2012: 3262-3265

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