"Low-power and high-throughput hardware design for the 3D-HEVC depth intra ..."

Vladimir Afonso et al. (2017)

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DOI: 10.1109/ISCAS.2017.8050463

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-10

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Vladimir Afonso, Altamiro Amadeu Susin, Luan Audibert, Mário Saldanha, Ruhan A. Conceição, Marcelo Schiavon Porto, Bruno Zatt, Luciano Volcan Agostini:
Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip. ISCAS 2017: 1-4

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