"Challenges to realize highly reliable SiC power devices: From the current ..."

Junji Senzaki et al. (2018)

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DOI: 10.1109/IRPS.2018.8353558

access: closed

type: Conference or Workshop Paper

metadata version: 2019-01-22

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Junji Senzaki, Shohei Hayashi, Yoshiyuki Yonezawa, Hajime Okumura:
Challenges to realize highly reliable SiC power devices: From the current status and issues of SiC wafers. IRPS 2018: 3

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