"Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 ..."

Hariram Mohanram et al. (2024)

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DOI: 10.1109/IRPS48228.2024.10529391

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Hariram Mohanram, Harikrishnan Kumarasamy, Choong-Un Kim, Young-Joon Park, Srikanth Krishnan:
Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current. IRPS 2024: 1-6

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