"Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless ..."

Alicja Lesniewska et al. (2020)

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DOI: 10.1109/IRPS45951.2020.9129246

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-23

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Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes:
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS 2020: 1-6

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