"Impacts of 3-D integration processes on device reliabilities in thinned ..."

Kang Wook Lee et al. (2015)

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DOI: 10.1109/IRPS.2015.7112733

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS 2015: 4

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