"Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA ..."

Moon Soo Lee et al. (2021)

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DOI: 10.1109/IRPS46558.2021.9405133

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-05

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Moon Soo Lee, Inhak Baick, Min Kim, Seo Hyun Kwon, Myeong Soo Yeo, Hwasung Rhee, Euncheol Lee:
Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique. IRPS 2021: 1-6

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