"High-density fan-out technology for advanced SiP and 3D heterogeneous ..."

Kangwook Lee (2018)

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DOI: 10.1109/IRPS.2018.8353588

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-18

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Kangwook Lee:
High-density fan-out technology for advanced SiP and 3D heterogeneous integration. IRPS 2018: 4

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