"Analysis of electromigration-induced backflow stresses in Cu(Mn) ..."

Matthias Kraatz et al. (2018)

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DOI: 10.1109/IRPS.2018.8353598

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-29

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Matthias Kraatz, Christoph Sander, André Clausner, Meike Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech:
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. IRPS 2018: 4

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