"Middle-of-the-Line Reliability Characterization of ..."

Seongkyung Kim et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764599

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-09

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Seongkyung Kim, Ukjin Jung, Seungjin Choo, Kihyun Choi, Tae-Jin Chung, Shin-Young Chung, Euncheol Lee, Juhun Park, Deokhan Bae, Myungyoon Um:
Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology. IRPS 2022: 11

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