"Enhanced CDM-robustness for the packaged IC with the extra bonding wire to ..."

Tzu-Cheng Kao et al. (2015)

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DOI: 10.1109/IRPS.2015.7112797

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Tzu-Cheng Kao, Jian-Hsing Lee, Chen-Hsin Lien, Chih-Hsien Wang, Kuang-Cheng Tai, Hung-Der Su:
Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate. IRPS 2015: 6

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