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"Enhanced CDM-robustness for the packaged IC with the extra bonding wire to ..."
Tzu-Cheng Kao et al. (2015)
- Tzu-Cheng Kao, Jian-Hsing Lee, Chen-Hsin Lien
, Chih-Hsien Wang, Kuang-Cheng Tai, Hung-Der Su:
Enhanced CDM-robustness for the packaged IC with the extra bonding wire to the die-attach plate. IRPS 2015: 6
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