"Stress Induced Voiding Behavior of Electroplated Copper Thin Films in ..."

Clement Huang, Alex Juan, K. C. Su (2020)

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DOI: 10.1109/IRPS45951.2020.9128844

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-30

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Clement Huang, Alex Juan, K. C. Su:
Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. IRPS 2020: 1-3

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