"Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown ..."

Lin Hou et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764478

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-09

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Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne:
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism. IRPS 2022: 4

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