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"Electromigration of multi-solder ball test structures."

Christine S. Hau-Riege et al. (2018)

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DOI: 10.1109/IRPS.2018.8353608

access: closed

type: Conference or Workshop Paper

metadata version: 2019-01-22

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  dblp key:
  - conf/irps/Hau-RiegeXYKLZF18
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  persistent URL:
  - https://dblp.org/rec/conf/irps/Hau-RiegeXYKLZF18
Christine S. Hau-Riege, Huilin Xu, You-Wen Yau, Manasi S. Kakade, Jianfeng Li, Xiaonan Zhang, Hosain Farr:
Electromigration of multi-solder ball test structures. IRPS 2018: 5

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