"Numerical Simulation and Characterization of PCB Warpage."

M. Hamid et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764416

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-09

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M. Hamid, K. O'Connell, J. Bielick, J. Bennett, E. Campbell, A. Alfoqaha:
Numerical Simulation and Characterization of PCB Warpage. IRPS 2022: 16-1

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