"Device reliability for CMOS image sensors with backside through-silicon vias."

Jeff Peter Gambino et al. (2018)

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DOI: 10.1109/IRPS.2018.8353611

access: closed

type: Conference or Workshop Paper

metadata version: 2019-01-22

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Jeff Peter Gambino, H. Soleimani, I. Rahim, B. Riebeek, L. Sheng, G. Hosey, H. Truong, Gavin D. R. Hall, R. Jerome, D. Price:
Device reliability for CMOS image sensors with backside through-silicon vias. IRPS 2018: 5

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