"Wafer Level Chip Scale Package Failure Mode Prediction using Finite ..."

Viktor Dudash et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117636

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock:
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling. IRPS 2023: 1-6

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