"New Method to Perform TDDB Tests for Hybrid Bonding Interconnects."

Bassel Ayoub et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764446

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont:
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. IRPS 2022: 4

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