"M³-Modular Multi-Scale Assembly System for MEMS Packaging."

Dan O. Popa et al. (2006)

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DOI: 10.1109/IROS.2006.281751

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-22

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Dan O. Popa, Rakesh Murthy, Manoj Mitta, Jeongsik Sin, Harry E. Stephanou:
M³-Modular Multi-Scale Assembly System for MEMS Packaging. IROS 2006: 3712-3717

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