"Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes ..."

Bora Cakiroglu et al. (2008)

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DOI: 10.1109/IGARSS.2008.4779996

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Bora Cakiroglu, Peter J. Collins, Michael J. Havrilla, Kubilay Sertel, Andrew J. Terzuoli:
Fabrication of Multi-Scale Triangular Patch High Impedance Ground Planes to Improve the Bandwidth of Conformal Bow-Tie Antennas for Remote Sensing. IGARSS (4) 2008: 1406-1409

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