"Solder Bumping - A Flexible Joining Approach for the Precision Assembly of ..."

Erik Beckert et al. (2008)

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DOI: 10.1007/978-0-387-77405-3_13

access: open

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann:
Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems. IPAS 2008: 139-147

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