"Vacuum packaging and semipassive chips for wireless temperature monitoring ..."

María Tijero et al. (2017)

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DOI: 10.1109/ICSENS.2017.8234235

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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María Tijero, Xabier Eguiluz, Jorge Elizalde, Víctor Díez, Aitor Arriola, Iñigo Aranburu, Ander Zarketa, Manex Martinez-Agirre, Alain Martin-Mayor, M. M. Bou-ali:
Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications. IEEE SENSORS 2017: 1-3

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