"Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for ..."

Jieming Pan et al. (2020)

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DOI: 10.1109/SENSORS47125.2020.9278879

access: closed

type: Conference or Workshop Paper

metadata version: 2023-02-12

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Jieming Pan, Yida Li, Yuxuan Luo, Xiangyu Zhang, Zaifeng Yang, David Liang Tai Wong, Jessie Xuhua Niu, Chen-Khong Tham, Aaron Voon-Yew Thean:
Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance. IEEE SENSORS 2020: 1-4

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