"Thermal Condition Monitoring System Fully Printed on a 3D Substrate."

Marcel Knoll et al. (2019)

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DOI: 10.1109/SENSORS43011.2019.8956723

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-16

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Marcel Knoll, Christina Offenzeller, Bernhard Mayrhofer, Bernhard Jakoby, Wolfgang Hilber:
Thermal Condition Monitoring System Fully Printed on a 3D Substrate. IEEE SENSORS 2019: 1-4

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