"A novel packaging stress isolation structure for SOI based MEMS gyroscopes."

Yongcun Hao et al. (2016)

> Home

Details and statistics

DOI: 10.1109/ICSENS.2016.7808649

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-28

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ieeesensors/HaoYXC16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ieeesensors/HaoYXC16
Yongcun Hao, Weizheng Yuan, Jianbing Xie, Honglong Chang:
A novel packaging stress isolation structure for SOI based MEMS gyroscopes. IEEE SENSORS 2016: 1-3

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.