"A New Method for Detecting Leaks in MEMS Accelerometers at Wafer-Level."

Ulrich Baehr et al. (2020)

> Home

Details and statistics

DOI: 10.1109/SENSORS47125.2020.9278875

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ieeesensors/BaehrF0R020
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ieeesensors/BaehrF0R020
Ulrich Baehr, Marvin Freier, Matthew Lewis, Wolfgang Rosenstiel, Oliver Bringmann:
A New Method for Detecting Leaks in MEMS Accelerometers at Wafer-Level. IEEE SENSORS 2020: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.