"Low-temperature direct and indirect bonding using plasma activation for 3D ..."

Shicheng Zhou et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ICTA50426.2020.9331985

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-10

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icta3/ZhouQKW20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icta3/ZhouQKW20
Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang:
Low-temperature direct and indirect bonding using plasma activation for 3D integration. ICTA 2020: 130-132

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.