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"Optimization of deformations and hoop stresses in TSV liners to boost ..."

Mary Atieno Juma et al. (2015)

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DOI: 10.1117/12.2228516

access: closed

type: Conference or Workshop Paper

metadata version: 2018-03-09

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  dblp key:
  - conf/icmv/JumaZHA15
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  - https://dblp.org/rec/conf/icmv/JumaZHA15
Mary Atieno Juma, Xuliang Zhang, Song Bai He, Ahmed I. A. Abusabah:
Optimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances. ICMV 2015: 987528

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