"Junction Integrity for 28nm High-k nMOSFETs with Thermal Stress."

Yu-Chen Lin et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ICKII50300.2020.9318948

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ickii/LinZZCCWW20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ickii/LinZZCCWW20
Yu-Chen Lin, Kai-Chun Zhan, Ji-Min Zhang, Jian-Ming Chen, Cheng-Hsun-Tony Chang, Shea-Jue Wang, Mu-Chun Wang:
Junction Integrity for 28nm High-k nMOSFETs with Thermal Stress. ICKII 2020: 64-66

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.