"A Multi-physics Simulation Based Parameters Optimization for Anisotropic ..."

Zhengjia Wang, Yuhui Wang, Zhouping Yin (2008)

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DOI: 10.1007/978-3-540-88518-4_96

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-03

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Zhengjia Wang, Yuhui Wang, Zhouping Yin:
A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging. ICIRA (2) 2008: 896-905

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