"Developing 3D Heterogeneous Structures for Future Chips."

Cheng Li et al. (2019)

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DOI: 10.1109/ICICDT.2019.8790942

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-27

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Cheng Li, Feilong Zhang, Mengfu Di, Zijin Pan, Albert Z. Wang:
Developing 3D Heterogeneous Structures for Future Chips. ICICDT 2019: 1-4

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