"Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit."

Mohammed Bougataya et al. (2010)

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DOI: 10.1109/ICECS.2010.5724516

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Mohammed Bougataya, Oussama Berriah, Ahmed Lakhssassi, Adel-Omar Dahmane, Yves Blaquière, Yvon Savaria, Richard Norman, Richard Prytula:
Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit. ICECS 2010: 315-318

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