"Thermal-Aware Floorplan Schemes for Reliable 3D Multi-core Processors."

Dong Oh Son et al. (2011)

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DOI: 10.1007/978-3-642-21887-3_36

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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Dong Oh Son, Young Jin Park, Jin Woo Ahn, Jaehyung Park, Jong-Myon Kim, Cheol Hong Kim:
Thermal-Aware Floorplan Schemes for Reliable 3D Multi-core Processors. ICCSA (2) 2011: 463-474

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