"Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in ..."

Jinwoo Kim et al. (2020)

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DOI: 10.1109/ICCD50377.2020.00030

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-11

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Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Mert Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim:
Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. ICCD 2020: 80-87

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