"Analytical thermal placement for VLSI lifetime improvement and minimum ..."

Andrew B. Kahng et al. (2007)

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DOI: 10.1109/ICCD.2007.4601882

access: closed

type: Conference or Workshop Paper

metadata version: 2023-12-21

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Andrew B. Kahng, Sung-Mo Kang, Wei Li, Bao Liu:
Analytical thermal placement for VLSI lifetime improvement and minimum performance variation. ICCD 2007: 71-77

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