"A novel dimension reduction technique for the capacitance extraction of 3D ..."

Wei Hong II et al. (1996)

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DOI: 10.1109/ICCAD.1996.569825

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Wei Hong II, Weikai Sun, Zhenhai Zhu, Hao Ji, Ben Song, Wayne Wei-Ming Dai:
A novel dimension reduction technique for the capacitance extraction of 3D VLSI interconnects. ICCAD 1996: 381-386

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