"Design method and test structure to characterize and repair TSV defect ..."

Minki Cho et al. (2010)

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DOI: 10.1109/ICCAD.2010.5654255

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Minki Cho, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay:
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system. ICCAD 2010: 694-697

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