"ThermalScope: multi-scale thermal analysis for nanometer-scale integrated ..."

Nicholas Allec et al. (2008)

> Home

Details and statistics

DOI: 10.1109/ICCAD.2008.4681639

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/iccad/AllecHSDY08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/iccad/AllecHSDY08
Nicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick, Ronggui Yang:
ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuits. ICCAD 2008: 603-610

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.