"i-Bond: A Next Generation Bond's Issuing Service System."

Ji Liu et al. (2022)

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DOI: 10.1007/978-3-031-23495-8_3

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

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Ji Liu, Zheng Xu, Yilin Sai, Yanmei Zhang, Dong Yuan, Shiping Chen:
i-Bond: A Next Generation Bond's Issuing Service System. ICBC 2022: 29-47

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