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"A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication."
Ramin Farjadrad, Bapiraju Vinnakota (2019)
- Ramin Farjadrad, Bapiraju Vinnakota:
A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication. Hot Interconnects 2019: 27-273
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