"3D FPGA & 3D ASIC worlds first unified 3D IC design platform."

Raminda Madurawe (2010)

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DOI: 10.1109/HOTCHIPS.2010.7480079

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type: Conference or Workshop Paper

metadata version: 2023-03-24

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Raminda Madurawe:
3D FPGA & 3D ASIC worlds first unified 3D IC design platform. Hot Chips Symposium 2010: 1-16

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