"Compact thermal modeling for package design with practical power maps."

Zao Liu et al. (2011)

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DOI: 10.1109/IGCC.2011.6008577

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Zao Liu, Sheldon X.-D. Tan, Hai Wang, Rafael Quintanilla, Ashish Gupta:
Compact thermal modeling for package design with practical power maps. IGCC 2011: 1-5

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