"An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs."

Prachi Shukla et al. (2019)

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DOI: 10.1145/3299874.3319485

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, Emre Salman:
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. ACM Great Lakes Symposium on VLSI 2019: 439-444

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