"An Effective TSV Self-Repair Scheme for 3D-Stacked ICs."

Songwei Pei et al. (2015)

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DOI: 10.1145/2742060.2742071

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-12

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Songwei Pei, Jingdong Zhang, Yu Jin, Song Jin, Jun Liu, Weizhi Xu:
An Effective TSV Self-Repair Scheme for 3D-Stacked ICs. ACM Great Lakes Symposium on VLSI 2015: 21-26

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