"Investigating Different Augmented Reality Approaches in Circuit Assembly: ..."

Bernardo Marques et al. (2019)

> Home

Details and statistics

DOI: 10.2312/EGS.20191011

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/eurographics/MarquesEAFDS19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/eurographics/MarquesEAFDS19
Bernardo Marques, Rafael Esteves, João Alves, Carlos Ferreira, Paulo Dias, Beatriz Sousa Santos:
Investigating Different Augmented Reality Approaches in Circuit Assembly: a User Study. Eurographics (Short Papers) 2019: 45-48

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.