"Test Solutions for High Density 3D-IC Interconnects - Focus on ..."

Imed Jani et al. (2019)

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DOI: 10.1109/ETS.2019.8791531

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Edith Beigné:
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS 2019: 1-2

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